- U.S. EPA-IPC Design for the Environment Printed Wiring Board Project

- IST Presentation prepared By Atotech Germany

- C99-51 Evaluation of IST/Temp Cycle by C.A.L.C.E.

- Daimler-Paper

- Nelco Paper

- Northrup Grunman Paper

- Advanced testing using real life evaluation and data analysis

- Advanced testing using real life evaluation and data analysis rnd 2

- A case study influencing IST reliability

- IST article in Circuit Tree  Magazine

- Multek Correlation paper

- S07 Suzuki Microvia Reliability

- S18-3-long  Lead Free reliability

- SMTA May06 rev1 Effects of Lead Free Soldering on Plating Via

- Microvia reliability Paper

 

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