DISTINGUISHING ATTRIBUTES
Compared to Traditional Methods
Operator independent
Flexible test parameters
Capable of creating isolated thermal zones (related to coupon circuit design)
Data collection and analysis integrated
Immediate use ("Plug and Play")
Weakest link in the chain identified
Floor space optimized / Portability
Highly reliable
THE FUTURE IS WITH THE IST TECHNOLOGY
IST Technology is now capable of providing to the Printed Wiring Board Industry a new revolutionary method of testing which have the following characteristics
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IST removes the ambiguity
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IST accelerates throughput
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IST reduces overall cost, and
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IST improves customer satisfaction
IST technology is the first test system capable of quantifying various types of post separation and PTH degradation that occur simultaneously or independently. The following Figures 1 to 5 illustrate clearly the type of information or data that can be obtained through the IST technology.
Fig. 1 illustrates a standard graph that shows the interactions that occur between the PTH and Post interconnects during stress testing. Labels have been added to describe the various conditions and levels of fatigue.
Fig. 1
Fig. 2 depicts the resistance degradation (failure) of the PTH interconnect. The Post resistance shows minimal change from the start to finish of the stress testing. This result would constitute a traditional PTH failure mechanism, with high quality post interface.
Fig. 2
Fig. 3 illustrates marginal post separation. The post interconnect resistance showed a progressive increase until the PTH "went" to failure. This illustrates the redistribution of strain between the PTH and Post interconnects.
Fig.3
Fig. 4. describes the gross post separation condition. The post interconnect resistance increases very rapidly, although the PTH interconnect resistance remains stable.
Fig. 4
Various types and levels of post separation were created under controlled conditions, Fig. 5 shows how IST quantifies the resistance degradation at the post interconnect in relation to the number of accelerated stress cycles.
Fig. 5
Fig. 5 also demonstrates the IST capability to quantify the various types/levels of post separation. Studies were completed with different types of separation being created at the post to barrel junction. The levels of electrical degradation within the post interconnect are combined with the performance of the PTH interconnect; both levels of interconnects data permit the integrity assessment of the total interconnect.