Generic Design Overview
The
Generic IST coupons are designed to enable the customer to use a single
design for multiple applications. The intent is to permit flexibility in
the construction, related to number of layers, stack-up, copper weights
and feature sizes (within the limits of the instructions included within
each design file).
Each
commonly used technology (Plated through hole, blind via, buried via,
micro via, sequential lamination and back plane) is supported. Please
follow the links in the Technology flow chart to determine which coupon
design is best suited to fit the application.
Custom Designs
If the
Generic files do not suit your purpose, custom design files are available
upon request. In order to identify the most appropriate design it is
necessary to complete an IST Design Work Sheet. The required details identify the type of
technology (PTH, Blind/Buried Via, Microvia, Sequential lamination, Back
Plane, Etc.) to be constructed. Additional information regarding the
number of layers and function, basic construction, copper weights,
attribute sizes and via grid (pitch) size. Following the submittal of the work sheet, communications will be initiated
to confirm whether an existing file or new design will suit the design intent.
